JPS6161261B2 - - Google Patents

Info

Publication number
JPS6161261B2
JPS6161261B2 JP53063598A JP6359878A JPS6161261B2 JP S6161261 B2 JPS6161261 B2 JP S6161261B2 JP 53063598 A JP53063598 A JP 53063598A JP 6359878 A JP6359878 A JP 6359878A JP S6161261 B2 JPS6161261 B2 JP S6161261B2
Authority
JP
Japan
Prior art keywords
electrode
layer
etching
substrate
material layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53063598A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54154289A (en
Inventor
Isao Oota
Haruhiro Shirasawa
Toshio Tatemichi
Hiroshi Kawarada
Tetsuo Ootsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6359878A priority Critical patent/JPS54154289A/ja
Priority to US06/041,507 priority patent/US4332075A/en
Publication of JPS54154289A publication Critical patent/JPS54154289A/ja
Publication of JPS6161261B2 publication Critical patent/JPS6161261B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/675—Group III-V materials, Group II-VI materials, Group IV-VI materials, selenium or tellurium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/98—Utilizing process equivalents or options
JP6359878A 1978-05-26 1978-05-26 Manufacture of thin-film transistor array Granted JPS54154289A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6359878A JPS54154289A (en) 1978-05-26 1978-05-26 Manufacture of thin-film transistor array
US06/041,507 US4332075A (en) 1978-05-26 1979-05-22 Method of producing thin film transistor array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6359878A JPS54154289A (en) 1978-05-26 1978-05-26 Manufacture of thin-film transistor array

Publications (2)

Publication Number Publication Date
JPS54154289A JPS54154289A (en) 1979-12-05
JPS6161261B2 true JPS6161261B2 (en]) 1986-12-24

Family

ID=13233862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6359878A Granted JPS54154289A (en) 1978-05-26 1978-05-26 Manufacture of thin-film transistor array

Country Status (2)

Country Link
US (1) US4332075A (en])
JP (1) JPS54154289A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63161059U (en]) * 1987-04-10 1988-10-20

Families Citing this family (51)

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Publication number Priority date Publication date Assignee Title
JP2690446B2 (ja) * 1980-03-27 1997-12-10 キヤノン 株式会社 非晶質シリコン薄膜トランジスタの製造法
JPS56161676A (en) 1980-05-16 1981-12-12 Japan Electronic Ind Dev Assoc<Jeida> Electrode structure for thin film transistor
JPS5799774A (en) * 1980-11-19 1982-06-21 Sharp Corp Forming method for thin-film transistor
US4517733A (en) * 1981-01-06 1985-05-21 Fuji Xerox Co., Ltd. Process for fabricating thin film image pick-up element
US4459739A (en) * 1981-05-26 1984-07-17 Northern Telecom Limited Thin film transistors
GB2107115B (en) * 1981-07-17 1985-05-09 Citizen Watch Co Ltd Method of manufacturing insulated gate thin film effect transitors
US4404731A (en) * 1981-10-01 1983-09-20 Xerox Corporation Method of forming a thin film transistor
JPS58170067A (ja) * 1982-03-31 1983-10-06 Fujitsu Ltd 薄膜トランジスタの製造方法
JPS58178553A (ja) * 1982-04-13 1983-10-19 Seiko Epson Corp マトリツクスアレ−
JPS58190042A (ja) * 1982-04-28 1983-11-05 Toshiba Corp 薄膜半導体装置
US5365079A (en) * 1982-04-30 1994-11-15 Seiko Epson Corporation Thin film transistor and display device including same
US5650637A (en) * 1982-04-30 1997-07-22 Seiko Epson Corporation Active matrix assembly
US5677547A (en) * 1982-04-30 1997-10-14 Seiko Epson Corporation Thin film transistor and display device including same
FR2533072B1 (fr) * 1982-09-14 1986-07-18 Coissard Pierre Procede de fabrication de circuits electroniques a base de transistors en couches minces et de condensateurs
FR2571893B2 (fr) * 1982-09-14 1986-12-26 France Etat Procede de fabrication de circuits electroniques a base de transistors en couches minces et de condensateurs
JPH0693509B2 (ja) * 1983-08-26 1994-11-16 シャープ株式会社 薄膜トランジスタ
JPS60186066A (ja) * 1984-03-05 1985-09-21 Semiconductor Energy Lab Co Ltd 絶縁ゲイト型電界効果半導体装置およびその作製方法
JPS60189265A (ja) * 1984-03-08 1985-09-26 Matsushita Electric Ind Co Ltd 薄膜電界効果型半導体装置
US4882233A (en) * 1984-05-30 1989-11-21 Chronar Corp. Selectively deposited electrodes onto a substrate
US4689116A (en) * 1984-10-17 1987-08-25 L'etat Francais Represented By The Minister Of Ptt (Centre National D'etudes Des Telecommunications) Process for fabricating electronic circuits based on thin-film transistors and capacitors
EP0181191B1 (en) * 1984-11-05 1996-02-28 Hitachi, Ltd. Superconducting device
US4732830A (en) * 1984-11-13 1988-03-22 Copytele, Inc. Electrophoretic display panels and associated methods
JPH0654782B2 (ja) * 1985-02-08 1994-07-20 セイコー電子工業株式会社 薄膜トランジスタ装置の製造方法
FR2586859B1 (fr) * 1985-08-27 1987-11-20 Thomson Csf Procede de fabrication d'un transistor de commande pour ecran plat de visualisation et element de commande realise selon ce procede
JPS6276545A (ja) * 1985-09-30 1987-04-08 Toshiba Corp 表示装置用駆動回路基板
EP0217406B1 (en) * 1985-10-04 1992-06-10 Hosiden Corporation Thin-film transistor and method of fabricating the same
DE3640174A1 (de) * 1985-11-27 1987-06-04 Sharp Kk Duennfilm-transistor-anordnung
US4803536A (en) * 1986-10-24 1989-02-07 Xerox Corporation Electrostatic discharge protection network for large area transducer arrays
US4994401A (en) * 1987-01-16 1991-02-19 Hosiden Electronics Co., Ltd. Method of making a thin film transistor
US5204762A (en) * 1987-10-30 1993-04-20 Canon Kabushiki Kaisha Image reading device
US4859623A (en) * 1988-02-04 1989-08-22 Amoco Corporation Method of forming vertical gate thin film transistors in liquid crystal array
US5037766A (en) * 1988-12-06 1991-08-06 Industrial Technology Research Institute Method of fabricating a thin film polysilicon thin film transistor or resistor
US5264077A (en) * 1989-06-15 1993-11-23 Semiconductor Energy Laboratory Co., Ltd. Method for producing a conductive oxide pattern
JP2999271B2 (ja) * 1990-12-10 2000-01-17 株式会社半導体エネルギー研究所 表示装置
JPH05243571A (ja) * 1991-07-12 1993-09-21 Sanyo Electric Co Ltd 電界効果型トランジスタアレイ
JPH088365B2 (ja) * 1991-07-12 1996-01-29 三洋電機株式会社 電界効果型トランジスタアレイ
JP3124085B2 (ja) * 1991-12-02 2001-01-15 沖電気工業株式会社 半導体装置
CN100502054C (zh) * 1992-07-06 2009-06-17 株式会社半导体能源研究所 半导体器件的制造方法
JP2538523B2 (ja) * 1994-08-10 1996-09-25 三洋電機株式会社 液晶マトリクスパネルの製造方法
JP2677237B2 (ja) * 1995-03-31 1997-11-17 セイコーエプソン株式会社 液晶表示装置の製造方法
JP2602007B2 (ja) * 1995-07-24 1997-04-23 株式会社東芝 薄膜半導体装置の製造方法
US6080606A (en) * 1996-03-26 2000-06-27 The Trustees Of Princeton University Electrophotographic patterning of thin film circuits
JPH09318975A (ja) * 1996-05-30 1997-12-12 Nec Corp 薄膜電界効果型トランジスタ素子アレイおよびその製造 方法
KR100232679B1 (ko) * 1996-11-27 1999-12-01 구본준 액정표시장치의 제조방법 및 그 구조
US5937272A (en) * 1997-06-06 1999-08-10 Eastman Kodak Company Patterned organic layers in a full-color organic electroluminescent display array on a thin film transistor array substrate
EP1507165A1 (en) * 1997-08-28 2005-02-16 E Ink Corporation Novel addressing schemes for electrophoretic displays
US20030044516A1 (en) * 2001-08-31 2003-03-06 Ryuji Nishikawa Method for manufacturing electroluminescence display panel and evaporation mask
TW589917B (en) * 2001-08-31 2004-06-01 Sanyo Electric Co Method for making electroluminescence element and vapor deposition mask
US7063978B2 (en) * 2001-11-01 2006-06-20 3M Innovative Properties Company Coated film laminate having an electrically conductive surface
KR101960813B1 (ko) * 2011-10-31 2019-03-22 삼성디스플레이 주식회사 표시 기판 및 이의 제조 방법
US9934983B2 (en) * 2014-02-03 2018-04-03 Cree, Inc. Stress mitigation for thin and thick films used in semiconductor circuitry

Family Cites Families (7)

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NL282170A (en]) * 1961-08-17
DE1277374B (de) * 1964-09-30 1968-09-12 Hitachi Ltd Mechanisch-elektrischer Wandler
NL6501946A (en]) * 1965-02-17 1966-08-18
US3423821A (en) * 1965-03-18 1969-01-28 Hitachi Ltd Method of producing thin film integrated circuits
US3649369A (en) * 1970-03-09 1972-03-14 Hughes Aircraft Co Method for making n-type layers in gallium arsenide at room temperatures
US3766637A (en) * 1972-05-04 1973-10-23 Rca Corp Method of making mos transistors
US4213807A (en) * 1979-04-20 1980-07-22 Rca Corporation Method of fabricating semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63161059U (en]) * 1987-04-10 1988-10-20

Also Published As

Publication number Publication date
US4332075A (en) 1982-06-01
JPS54154289A (en) 1979-12-05

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